IC Failure Analysis - Analysis Principles and Procedures
Basic principles:
No damage first, then damage later.
First conduct an electrical test, inspect the appearance, and then open the lid.
After opening the lid, it should be undamaged first (without introducing new damage), and then destroyed.
1. Failure phenomenon record: Understand the situation, learn about the failure site information, parameter test results of the failed sample, and some product information of the failed sample.
2. Identify failure modes: Use existing equipment to confirm whether the product failure is consistent with the customer's description, and truthfully record the failure situation.
3. Describe the failure characteristics in your own language.
4. Follow the failure analysis procedure - check and analyze. There are usually several steps involved: visual inspection, electrical parameter measurement, short-circuit test, X-ray inspection, ultrasonic cleaning, ultrasonic delamination analysis, cap opening, internal visual inspection, electron scanning microscope, corrosion ball and inspection of the pressure zone.
5. The above steps are not required for each step and should be targeted. If a problem is found in any step, the following steps can be omitted depending on the situation.
6. Summarize and analyze the conclusions, and put forward your own opinions on the analysis results.
7. Propose corrective suggestions and measures.
Provide an analysis report.
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