The Beijing Sanhe Lian desktop plasma etching machine series products are based on capacitive coupled plasma technology and are domestically developed desktop plasma etching machines with intellectual property rights. Suitable for photoresist/organic removal, rapid etching of four group materials, chip failure analysis layer removal/back silicon etching/cover opening and other applications, it is a high-quality product of domestic desktop plasma etching machine.

Desktop plasma etching machine (SV-RIE) main configuration:

1.Desktop plasma etching machine (SV-RIE) main configuration: 1 Supporting sample sizes: 4, 6, 8, 12 inches, compatible with various small-sized samples, and supporting customization;

2.RF plasma power range: 300W/500W/1000W/customized;

3.Front stage pump: mechanical oil pump/dry pump optional;

4.Process gas: Up to 5 process gases can be equipped simultaneously;

5.Gas range: determined according to user application requirements and system design, selectable within the range of 0~1000 sccm;

6.Detachable anti pollution lining (optional);

7.Fully automatic one key control system;

Desktop plasma etching machine (SV-RIE) suitable materials:

1. Desktop plasma etching machine (SV-RIE) suitable materials: 1 Silicon based materials: silicon (Si), silicon dioxide (SiO2), silicon nitride (SiNx), silicon carbide (SiC)

2. Organic materials: photoresist (PR), organic polymers (PMMA/HDMS), organic thin films

The desktop plasma etching machine series products of Beijing Sanhe Lian Technology Co., Ltd. are based on capacitive coupled plasma technology and are independently developed machines with intellectual property rights. Suitable for applications such as photoresist/organic removal, rapid etching of four group materials, chip failure analysis layer removal/back silicon etching/cover opening, etc.

该系列产品具有如下特点：

1）一体型机台，整机Footprint为630mm*600mm；

2）基于工控机的控制方案，自主开发的全自动控制系统，带菜单；

3）机台配置灵活，可单片使用；

4）模块化设计，维护与升级极其方便； 

5）工艺稳定，性能优越

Desktop plasma etching machine (SV-RIE) related applications：

1. Organic material etching is applied to the etching, cleaning, and removal of organic materials such as photo resist, PMMA, HDMS, and polymer;

2. Rapid etching of four group materials;

3. Back silicon etching;

4. Plastic seal opening cover;

5. Failure Analysis FA (Failure Analysis FA) for chip delamination and etching;

桌面型等离子体刻蚀机 (SV-RIE) 系列型号：

1. SHL100SV-RIE

2. SHL150SV-RIE

3. SHL200SV-RIE

感应耦合等离子体刻蚀 (SV-RIE) 设备Layout：

SV-RIE 机台 Layout