IC Failure Analysis - Reliability Testing

Reliability Concept:

The ability of a system or device to complete a specified function under specified conditions and within a specified time. There are two types of reliability: intrinsic reliability and operational reliability. Intrinsic reliability refers to the inherent reliability formed through design and manufacturing, while operational reliability refers to the reliability demonstrated during use. It is affected by environmental conditions, operation, maintenance, and other factors, and its reliability is always lower than its inherent reliability.

Reliability Test (1)

Temperature cycle TCT: Determine the product's resistance to deformation at extremely high and low temperatures, as well as the effect of alternating between extremely high and low temperatures.

Thermal shock TST: Same as above, but with stricter conditions

High pressure steaming PCT: Using strict pressure, moisture, and temperature to accelerate the permeation of water vapor to evaluate the effect of non sealed solid products on water vapor permeation.

Accelerated aging HAST: Same as above.

Reliability Test (2)

High temperature reverse bias HTRB: Applying a certain amount of high temperature to the product to accelerate the aging of its electrical performance.

Reflow soldering: Used to determine the thermal resistance and effects generated by SMD during the reflow soldering process.

Solderability SOLDER: Determine the weldability of a product.
Resistance to welding heat: Determine the thermal resistance and effects generated during the welding process of direct insertion products.

Lead bending: Assessing the ability of product pins to resist mechanical strain.

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