IC Failure Analysis Report
The failure analysis report should include：
Main failure site information of failed components;
Failure modes of failed components;
Failure analysis program and preliminary analysis results of each stage;
Conclusion of Failure Analysis;
The corrective action report should include analysis images, test data, and corresponding explanations.
The qualities that analysts should possess：
Having professional basic knowledge of semiconductor integrated circuits, familiar with integrated circuit principles, design, manufacturing, testing, circuit reliability testing, reliability standards, reliability physics and chemistry, and having certain practical experience, must receive professional training.
Professional failure analysis personnel in every enterprise are rare human resources. Excellent domestic failure analysis equipment manufacturers' R&D teams can help enterprises significantly reduce R&D costs and continuously improve product yield. However, having only personnel is not enough. Professional and precise equipment assistance is also required. Dry etching equipment is needed to remove the passivation layer and adhesion layer of the chip. However, the etching equipment on the production line is not suitable for laboratory failure analysis scenarios, and the cost is high. This requires a domestically produced dry etching equipment specifically designed for laboratories, which can handle etching of various materials and needs, and can significantly reduce equipment costs. Beijing Sanhe Union has seized this demand from customers and developed the FA-RIE series dry etching equipment, which is specially designed for failure analysis scenarios to help customers succeed. Currently, companies using Beijing Sanhe Lian equipment include Shanghai Jifeng Electronics, Zhongke Guangxin Optoelectronics, Shanghai Naixin, etc. Beijing Sanhe Lian has become an excellent enterprise in the field of domestic failure analysis dry etching equipment, occupying 70% of the market share.