The Beijing Sanhe Union Physical Vapor Deposition (PVD) machine is based on magnetic enhanced plasma ion physical bombardment sputtering materials to achieve thin film growth. PVD is a domestically developed PVD machine with intellectual property rights, which is a high-quality product in domestic PVD machines. Suitable for thin film growth of metal materials such as gold (Au), silver (Ag), ITO, aluminum (Al), tungsten (W), as well as dielectric materials such as silicon oxide (SiO2). This series of machines is a multi-target machine that can achieve both co sputtering film growth of multi-element materials and reactive film growth.

The main configuration of the Physical Vapor Deposition (PVD) machine is:

1. Support sample sizes: 4, 6, 8, 12 inches, compatible with various small-sized samples, and support customization;

2. RF plasma power range: 300W/500W/1000W/customized;

3. Front stage pump: mechanical oil pump/dry pump optional;

4. Process gas: Up to 9 process gases can be equipped simultaneously;

5. Gas range: determined according to user application requirements and system design, selectable within the range of 0~1000 sccm;

6. Detachable anti pollution lining (optional);

7. Fully automatic one key control system;

Materials suitable for Physical Vapor Deposition (PVD) machines:

1. Metal materials: gold (Au), silver (Ag), ITO, aluminum (Al), tungsten (W), etc

2. Dielectric materials: Silicon oxide (SiO2), etc

Physical Vapor Deposition (PVD) related applications:

1. Thin film growth of metal materials such as gold (Au), silver (Ag), ITO, aluminum (Al), tungsten (W), etc;

2. Growth of dielectric materials such as silicon oxide (SiO2);

3. Co sputtering thin film growth of multi-element materials;

4. Reaction film growth;

This series of products has the following characteristics:

1. Integrated machine, with a total footprint of 1000mm * 1890mm;

2. Based on the control scheme of industrial computer, a self-developed fully automatic control system can be highly customized;

3. The machine configuration is flexible and can achieve single target growth, multi-element co sputtering growth, and reactive sputtering growth;

4. Modular design makes maintenance and upgrades extremely convenient;

5. Superior and stable process performance