Basic Concepts of Chip Failure Analysis

General concept

Failure: The product loses its designated function;

Failure analysis: Analysis and inspection of products without determining and analyzing the failure modes,mechanisms, causes, and properties of time sensitive components;

Failure mode: the manifestation of failure;

Failure mechanism: the physical and chemical processes that cause device failure;

Reason for failure: The direct cause of failure, including manufacturing, use, and management issues;

The purpose of failure analysis: Failure analysis is the post inspection of failed devices. Through failure analysis, it can verify whether the device has failed, identify failure modes, determine failure mechanisms and causes, and propose corresponding countermeasures based on the conclusions of failure analysis. It includes improvements in device production processes, design, materials, use, and management to eliminate the failure modes or mechanisms mentioned in the failure analysis report and prevent such failures from happening again.

Basic Concepts of Chip Failure Analysis

At present, there are many scenarios for conducting failure analysis in China, including various Fab equipment manufacturers establishing pilot laboratories and specialized failure analysis teams to improve product yield and shorten new product testing time. At the same time, there are also some third-party laboratories dedicated to undertaking failure analysis business. The removal of passivation layer in failure analysis requires specialized dry etching equipment. Beijing Sanhe Union Technology Co., Ltd. is a domestic manufacturer that develops RIE reaction ion etching machines specifically for failure analysis dry etching, filling the gap in domestic etching equipment. 

This domestic etching equipment can adapt to various etching materials, meet the selective etching process requirements of passivation layer, adhesion layer, back silicon, and tungsten hole, and significantly reduce equipment costs compared to mass production equipment, reducing the cost pressure on buyers. Currently, third-party failure analysis manufacturers jointly operated by Beijing Sanhe Union include Shengke Nano, Radio and Television Metrology, and other manufacturers.