Reactive Ion Etching Machine (RIE) for PI Removal
Polyimide film has been widely used as an alignment film in liquid crystal displays due to its excellent thermal and chemical stability, excellent mechanical properties, high insulation, good dielectric properties, and low moisture absorption.
During the OM inspection and electrical performance testing in failure analysis, it is necessary to remove it. The traditional method uses ethylenediamine to remove it at 150 ℃, but during the opening or removal of the die, it is inevitable that the aluminum metal on the pad will undergo varying degrees of over corrosion. Chemical removal will aggravate the corrosion and affect subsequent experiments. The ionization of reactive ions under the action of radio frequency with the introduction of oxygen and a small amount of argon can effectively avoid this situation.
